It was rumored during the production of Qualcomm’s flagship chips that there was a possibility that the company would be delaying the supply of its Snapdragon 810 chipset due to overheating and GPU driver issues. While several OEMs (original equipment manufacturers) have not prevented themselves from assimilating Qualcomm’s latest offering to their devices, such as LG’s G Flex 2 and Xiaomi’s recently announced flagship phone, the Mi Note Pro, Samsung seems to be having a hard time being convinced regarding the reliability of the company’s chip.
LG stated earlier that it will be working on future designs to make sure that there is a way to quickly dissipate the heat generated from the chip. Samsung was reported to drop Qualcomm’s chips in favor of its own Exynos chipset. However, it looks like Qualcomm will be looking to adopt a whole new design on addressing the heat issues on its chip as well as coming up with a way to eliminate the Adreno 430 GPU driver issues.
Qualcomm currently possesses 66 percent of the mobile chipset market and since Samsung is the world largest Android smartphone maker, it can be speculated that Samsung will not be willing to adopt Qualcomm’s solution in order to increase the grip, notoriety and market share of its own homegrown chipsets.
According to LG, a heating issue should not directly be the responsibility of the ‘system on a chip’ because the smartphone’s design also impacts on the level of heat generated within the chassis of the device.
Samsung’s upcoming Galaxy S6, which will feature a premium design as well as being rumored to possess two curved edged displays and 4 GB of RAM, was going to house Qualcomm’s Snapdragon 810 chipset. However, if Qualcomm is not able to bring a solution to mitigate the heating issue, the Samsung will have no choice but to incorporate its own flagship chipset.
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